20.02.2013 Views

BioSciences - Polysciences, Inc.

BioSciences - Polysciences, Inc.

BioSciences - Polysciences, Inc.

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

NoSWEEP Wire Bond Encapsulant<br />

Electronic Adhesives & Encapsulants<br />

The patented technology Ring-lock dispense method (developed jointly with Kulicke & Soffa) was<br />

created especially for lead-frame and 3-D packages. NoSWEEP s unique high performance<br />

epoxy chemistry allows a very small bead of material to be extruded across the wires. The material<br />

encapsulates a small section of the wires and is then UV gelled to lock the polymer and the wires<br />

in place before molding. Because only a very small amount of polymer is used, this process is an<br />

extremely cost effective solution for wire sweep and allows much broader design leeway.<br />

Side view SEM of NoSWEEP Ring-lock* dispense<br />

method completely encapsulating a wire section on<br />

a quad tier copper wire bonded device.<br />

Specific<br />

Gravity<br />

Viscosity<br />

@ 25°C<br />

(CPS)<br />

Tg<br />

(°C)<br />

Modulus<br />

@ 25°C<br />

(Mpa)<br />

Ring-lock Bead Encapsulant<br />

SEM of NoSWEEP Ring-lock* dispense method on<br />

the same quad tier copper wire bonded device.<br />

1.67 250K 174 9000 23 63 UVA 1J/cm2 @ 90°C<br />

Comments: UV + thermal cure, Ring-lock or full<br />

+ 60min @ 130+°C<br />

wire encapsulation; thermal cure during transfer<br />

180min @ 175°C<br />

mold post most cure cycle.<br />

(typical post mold cure)<br />

Wire Only Encapsulant<br />

1.80 115K >180 14000 14 29 UVA 1J/cm2 @ >90°C<br />

or 120min @ 130+°C<br />

Comments: Excellent flow through wires,<br />

UV-thermal cure.<br />

120min @ 170<br />

(typical post mold cure)<br />

Glob Top Wire Only Encapsulant<br />

1.70 50K 120 2000 20 70 60min @ 100+°C<br />

60min @ 165°C<br />

Comments: Low viscosity version of EW8003 for glob top or dam/fill.<br />

1.70 250K 160 2500 18 50 90min @ 100+°C<br />

60min @ 165°C<br />

Comments: High performance globe top, low moisture abs.<br />

1.70 50K 140 2000 20 80 2hrs @ 120°C<br />

or 30min @ 150°C<br />

** Product subject to dry ice shipment fee.<br />

CTE a1<br />

(ppm/°C)<br />

CTE a2<br />

(ppm/°C)<br />

Cure<br />

Schedule (°C)<br />

JEDEC<br />

Level<br />

Reflow<br />

Temp (°C)<br />

2A 260<br />

3 240<br />

2 260<br />

2 260<br />

2 260<br />

Catalog # Size<br />

For volume pricing, send<br />

e-mail requests to:<br />

info@polysciences.com<br />

or call:<br />

U.S. & Canada<br />

(215) 343-6484 or<br />

(800) 523-2575<br />

European Office<br />

+(49) 6221-765767<br />

Asia Pacific Office<br />

(866) 2 8712 0600<br />

EW7073-10** 5X10cc<br />

EW7072-10** 5X10cc<br />

EW8002-10** 5X10cc<br />

EW8003-10** 5X10cc<br />

EW8004** 5X10cc<br />

For more information please call (800) 523-2575 or visit: www.polysciences.com 311

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!