BioSciences - Polysciences, Inc.

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Electronic Adhesives & Encapsulants
NoSWEEP Wire Bond Encapsulant
NoSWEEP wire bond encapsulants are the flagship product line of Polysciences’ Electronic Adhesives & Encapsulants
Selection division. NoSWEEP eliminates wire sweep during transfer molding by locking the wires together. This
patented technology is ideal for ultra fine pitch wire bonds, multi-tier bonding and 3-D packaging. NoSWEEP can be
dispensed on conventional off-line dispense systems or in-line on an on-wire bonder dispenser made by Kulicke and
Soffa. There are UV, UV/Thermal and thermal cure versions.
The thermal cure glob top versions of NoSWEEP are designed for full device encapsulation. These products offer JEDEC
(see page 321 JEDEC reference guide) level 2A reliability and are designed to work with lead free (260°C) re-flow (see
JEDEC reliability test references). There is also a compatible dam for package designs which are not glob top friendly.
The NoSWEEP Patented Technology Process
Key Benefits vs. Conventional Molding Systems:
• Enables implementation of sub-35μm pitch roadmap wire bonding.
• Allows for the use of longer wires with low cost, high-density substrates and enables simple die shrinks.
• Enables cost reduction through the use of thinner diameter gold wire.
• Simplifies the design and production of complex stacked die and other 3-D package designs.
• NoSWEEP is Lead Free compatible.
NoSWEEP Products continue on next page
Complete Wire Encapsulation or Ring-Lock*
Complete Wire
Encapsulation
For more information please call (800) 523-2575 or visit: www.polysciences.com
Ring-Lock
Die attach
Wire bond
Wire encapsulation
Transfer molding