Sable CPU Module Specification
Sable CPU Module Specification Sable CPU Module Specification
8.4.3 Invalid Address - Bus Time-out ................................. 187 8.5 I/O Subsystem Errors ........................................... 188 8.6 C_ERR L Assertion . . ........................................... 188 Chapter 9 CPU POWERUP AND INITIALIZATION ................... 189 9.1 Processor Initialization .......................................... 189 9.1.1 Internal Processor Registers ................................... 189 9.1.2 Internal JSR stack ........................................... 189 9.2 B-Cache Initialization ........................................... 189 9.2.1 LDQ Data Format - BCC ENABLE B-CACHE INIT Set .............. 190 9.3 Duplicate Tag Store Initialization .................................. 191 9.4 System-bus Interface Initialization ................................. 191 9.5 CPU clocks and reset ........................................... 191 9.6 Power-up Sequence . . ........................................... 191 9.7 Powering Up with Bad Main Memory ............................... 192 Chapter 10 OVERVIEW OF THE CPU TESTABILITY FEATURES ...... 193 10.1 Bus Verification ............................................... 193 10.1.1 Address .................................................. 193 10.1.2 Data . . ................................................... 193 10.2 C4 EDC Generators ........................................... 193 10.3 C4 EDC Checkers . . ........................................... 194 10.4 DECchip 21064 EDC Checkers ................................... 194 10.5 DECchip 21064 EDC Generators ................................. 194 10.6 C4 Cobra-bus Probe Predicted Tag Parity Generator .................. 194 10.7 B-Cache Data Store Verification .................................. 194 10.8 B-Cache Tag/Control Store Verification . . . .......................... 194 10.9 Performance Counters ......................................... 195 10.10 Brain Dead Module Errors . . ................................... 195 Chapter 11 PHYSICAL AND ELECTRICAL CHARACTERISTICS ...... 197 viii 11.1 CPU Module Physical Specification ................................ 197 11.2 SABLE CPU CONNECTOR PINNING . . . .......................... 197 11.3 CPU Module Max DC Power Requirement .......................... 203
11.4 Environmental Specifications - Class B modified . . . .................. 203 11.4.1 Temperature . . . ........................................... 203 11.4.1.1 Storage ................................................ 203 11.4.1.2 Operating . . . ........................................... 203 11.4.2 Relative Humidity .......................................... 203 11.4.2.1 Storage ................................................ 204 11.4.2.2 Operating . . . ........................................... 204 11.4.3 Altitude .................................................. 204 11.4.3.1 Storage ................................................ 204 11.4.3.2 Operating Altitude ....................................... 204 11.4.4 Airflow ................................................... 204 11.4.5 Contamination . . ........................................... 204 11.4.6 Mean Time Between Failure (MTBF) Rate ....................... 204 11.4.7 Electrical Characteristics . . ................................... 204 11.4.7.1 AC References ........................................... 204 11.4.8 Clock Description ........................................... 204 11.4.9 AC and DC Characteristics ................................... 208 Appendix A ALPHA ARCHITECTURE OPTIONS SUPPORTED ....... 211 Appendix B SABLE CPU MODULE REGISTER REFERENCE GUIDE ............................................................... 213 Appendix C COBRA SPECIFIC ( PRIVILEGED ARCHITECTURE LIBRARY CODE ) PALCODE .................................... 223 C.1 Introduction .................................................. 223 C.2 PAL Environment . . ........................................... 223 C.3 Special PAL Instructions ........................................ 224 C.3.1 HW_MFPR and HW_MTPR ................................... 225 C.3.2 HW_LD and HW_ST ......................................... 227 C.3.3 HW_REI .................................................. 228 C.4 PAL Entry Points . . . ........................................... 228 C.5 General PALmode Restrictions ................................... 231 C.5.1 21064 PAL Restrictions ....................................... 231 C.5.2 21064 Specific PALmode Restrictions . .......................... 234 C.6 Powerup . . ................................................... 235 C.7 TB Miss Flows ................................................ 237 C.7.1 ITB Miss .................................................. 237 C.7.2 DTB Miss ................................................. 238 C.8 Error Flows .................................................. 239 ix
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8.4.3 Invalid Address - Bus Time-out ................................. 187<br />
8.5 I/O Subsystem Errors ........................................... 188<br />
8.6 C_ERR L Assertion . . ........................................... 188<br />
Chapter 9 <strong>CPU</strong> POWERUP AND INITIALIZATION ................... 189<br />
9.1 Processor Initialization .......................................... 189<br />
9.1.1 Internal Processor Registers ................................... 189<br />
9.1.2 Internal JSR stack ........................................... 189<br />
9.2 B-Cache Initialization ........................................... 189<br />
9.2.1 LDQ Data Format - BCC ENABLE B-CACHE INIT Set .............. 190<br />
9.3 Duplicate Tag Store Initialization .................................. 191<br />
9.4 System-bus Interface Initialization ................................. 191<br />
9.5 <strong>CPU</strong> clocks and reset ........................................... 191<br />
9.6 Power-up Sequence . . ........................................... 191<br />
9.7 Powering Up with Bad Main Memory ............................... 192<br />
Chapter 10 OVERVIEW OF THE <strong>CPU</strong> TESTABILITY FEATURES ...... 193<br />
10.1 Bus Verification ............................................... 193<br />
10.1.1 Address .................................................. 193<br />
10.1.2 Data . . ................................................... 193<br />
10.2 C4 EDC Generators ........................................... 193<br />
10.3 C4 EDC Checkers . . ........................................... 194<br />
10.4 DECchip 21064 EDC Checkers ................................... 194<br />
10.5 DECchip 21064 EDC Generators ................................. 194<br />
10.6 C4 Cobra-bus Probe Predicted Tag Parity Generator .................. 194<br />
10.7 B-Cache Data Store Verification .................................. 194<br />
10.8 B-Cache Tag/Control Store Verification . . . .......................... 194<br />
10.9 Performance Counters ......................................... 195<br />
10.10 Brain Dead <strong>Module</strong> Errors . . ................................... 195<br />
Chapter 11 PHYSICAL AND ELECTRICAL CHARACTERISTICS ...... 197<br />
viii<br />
11.1 <strong>CPU</strong> <strong>Module</strong> Physical <strong>Specification</strong> ................................ 197<br />
11.2 SABLE <strong>CPU</strong> CONNECTOR PINNING . . . .......................... 197<br />
11.3 <strong>CPU</strong> <strong>Module</strong> Max DC Power Requirement .......................... 203