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Sable CPU Module Specification

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Copyright © 1993 Digital Equipment Corporation.<br />

11.4.2.1 Storage<br />

10% to 95%<br />

11.4.2.2 Operating<br />

10% to 95% non-condensing at 304 meters of altitude.<br />

11.4.3 Altitude<br />

Reference: Standard Atmosphere, Standard Gravity.<br />

11.4.3.1 Storage<br />

The module is not mechanically or electrically damaged at altitudes up to 4.9 Km<br />

11.4.3.2 Operating Altitude<br />

The module can be operated up to 2.4 Km.<br />

11.4.4 Airflow<br />

Airflow must be at least 91.44 linear meters/minute.<br />

11.4.5 Contamination<br />

The module must be stored and used in a non-caustic environment.<br />

11.4.6 Mean Time Between Failure (MTBF) Rate<br />

The MTBF for the <strong>CPU</strong> module is TBD hours.<br />

11.4.7 Electrical Characteristics<br />

This module connects to the System bus backplane to an MCA 240-pin connector,<br />

two 299-pin PGA gate arrays, and one 44-pin PLCC arbitration gate array. System<br />

bus protocol signals are TTL levels, and backplane clocks are PECL levels.<br />

11.4.7.1 AC References<br />

System bus signals are driven relative to a TPHI1 or TPHI1_L rising edge. Receivers<br />

must latch these signals using a TPHI1 or TPHI1_L rising edge, respectively.<br />

11.4.8 Clock Description<br />

The module receives two differential clock signal pairs and AC couples them to two<br />

PECL to CMOS level converter chips (DC277BA DEC PN 21-36105-02). The four<br />

clock signals are routed on layer 4 etch from the connector pins and are 50mm using<br />

a 50 ohm etch impedance. Each of the four PECL clock signals connects to a 50 ohm<br />

termination (Thevenin - 82 ohms and 120 ohms - 5%) and two 680pF capacitors. etch<br />

from the connector pins and are 50mm using a 48 ohm etch impedance (12/20 lines).<br />

204 Physical and Electrical Characteristics

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