Elektromigration in Gold und Silber Nanostrukturen

Literatur 119
[71] W. Eberhardt, C. Kalus und L. Schleicher, Siemens Forschungs- und Entwicklungs-
bericht Bd. 1 Nr. 3/72, 315 (1972), Untersuchung von Halbleiterbauelementen mit
dem Rasterelektronenmikroskop.
[72] P. R. Besser, M. C. Madden, P. A. Flinn, J. Appl. Phys. 72(8), 3792 (1992), In-situ
scanning electron microscopy observation of the dynamic behaviour of electromi-
gration voids in passivated aluminum lines.
[73] B. H. Jo, R. W. Vook, Thin solid films 262, 129 (1995), In-situ ultra-high vacuum
studies of electromigration in copper films.
[74] Y.-C. Yoo, C. V. Thompson, S. P. Baker and E. Arzt, J. Appl. Phys. 85(4),
2108 (1997), Electromigration proximity effects of two neighboring fast-diffusion
segments in single-crystal aluminum lines.
[75] S.-H. Lee, J. C. Bravman, J. C. Doan, S. Lee, P. A. Flinn, T. N. Marieb, J. Appl.
Phys. 91(6), 3653 (2002), Stress-induced and electromigration voiding in aluminum
interconnects passivated with silicon nitride.
[76] M. A. Meyer, M. Herrmann, E. Langer, E. Zschech, Microel. Reliab. 64, 375
(2002), In-situ SEM observation of electromigration phenomena in fully embedded
copper interconnect structures.
[77] A. V. Vairagar, S. G. Mhaisalkar, A. Krishnamoorthy, K. N. Tu, A. M. Gusak, M.
A. Meyer, E. Zschech, Appl. Phys. Lett. 85(13), 2502 (2004), In-situ observati-
on of electromigration-induced void migration in dual-damascene Cu interconnect
structures.
[78] A. V. Vairagar, S. G. Mhaisalkar, M. A. Meyer, E. Zschech, A. Krishnamoorthy,
K. N. Tu, A. M. Gusak, Appl. Phys. Lett. 87, 081909 (2005), Direct evidence
of electromigration failure mechanisms in dual-damascene Cu interconnect tree
structures.
[79] I. A. Blech, E. S. Meieran, Appl. Phys. Lett. 11(8), 263 (1967), Direct transmission
electron microscope observations of electrotransport in aluminum thin films.
[80] C. N Liao, K. C. Chen, W. W. Wu, L. J. Chen, Appl. Phys. Lett. 87, 141903
(2005), In-situ transmission electron microscope observations of electromigration
in copper lines at room temperature.
[81] G. Schneider, D. Hambach, B. Niemann, B. Kaulich, J. Susini, N. Hoffmann, W.
Hasse, Appl. Phys. Lett. 78(13), 1936 (2001), In-situ x-ray microscopic observation
of the electromigration in passivated Cu interconnects.