Elektromigration in Gold und Silber Nanostrukturen
Elektromigration in Gold und Silber Nanostrukturen
Elektromigration in Gold und Silber Nanostrukturen
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Literatur 117<br />
[42] P.-C. Wang, R. G. Filippi, Appl. Phys. Lett. 78(23), 3598 (2001), Electromigration<br />
threshold <strong>in</strong> copper <strong>in</strong>terconnects.<br />
[43] L. Arnaud, T. Berger, G. Reimbold, J. Appl. Phys. 93(1), 192 (2003), Evidence of<br />
gra<strong>in</strong>-bo<strong>und</strong>ary versus <strong>in</strong>terface diffusion <strong>in</strong> electromigration experiments <strong>in</strong> copper<br />
damascene <strong>in</strong>terconnects.<br />
[44] S. Yokogawa, H. Tsuchiya, Jpn. J. Appl. Phys. 44(4A), 1717 (2005), Scal<strong>in</strong>g im-<br />
pacts on electromigration <strong>in</strong> narrow s<strong>in</strong>gle-damascene Cu <strong>in</strong>terconnects.<br />
[45] K. L. Lee, C. K. Hu, K. N. Tu, J. Appl. Phys. 78(7), 4428 (1995), In-situ scan-<br />
n<strong>in</strong>g electron microscope comparison studies on electromigration of Cu and Cu(Sn)<br />
alloys for advanced chip <strong>in</strong>terconnects.<br />
[46] J. He, Z. Suo, T. N. Marieb and J. A. Maiz, Appl. Phys. Lett. 85(20), 4639 (2004),<br />
Electromigration lifetime and critical void volume.<br />
[47] J. Ruth, J. Phys.: Condens. Matter 10, 2901 (1998), Measurement of electrotrans-<br />
port <strong>in</strong>duced excess vacancies <strong>in</strong> silver.<br />
[48] M. Hauder, J. Gstötter, W. Hansch and D. Schmitt-Landsiedel, Appl. Phys. Lett.<br />
78(6), 838 (2001), Scal<strong>in</strong>g properties and electromigration resistance of sputtered<br />
Ag metallization l<strong>in</strong>es.<br />
[49] E. Misra, T. L. Alford, Appl. Phys. Lett. 87, 172111 (2005), Effect of alloy<strong>in</strong>g and<br />
cladd<strong>in</strong>g on the failure of silver metallization <strong>und</strong>er high temperature and current<br />
stress<strong>in</strong>g.<br />
[50] B. J. Kle<strong>in</strong>, J. Phys. F: Metal Phys. 3, 691 (1973), Electromigration <strong>in</strong> th<strong>in</strong> gold<br />
films.<br />
[51] I. A. Blech, E. K<strong>in</strong>sbron, Th<strong>in</strong> Solid Films 25, 327 (1975), Electromigration <strong>in</strong><br />
th<strong>in</strong> gold films on Molybdenum surfaces.<br />
[52] M. Etzion, I. A. Blech, Y. Komem, J. Appl. Phys. 46(4), 1455 (1975), Study of<br />
conductive gold film lifetime <strong>und</strong>er high current densities.<br />
[53] K. L. Tai, M. Ohr<strong>in</strong>g, J. Appl. Phys. 48(1), 28 (1977), Gra<strong>in</strong>-bo<strong>und</strong>ary electromi-<br />
gration <strong>in</strong> th<strong>in</strong> films. I. Low temperature theory.<br />
[54] K. L. Tai, M. Ohr<strong>in</strong>g, J. Appl. Phys. 48(1), 36 (1977), Gra<strong>in</strong>-bo<strong>und</strong>ary electromi-<br />
gration <strong>in</strong> th<strong>in</strong> films. II. Tracer measurements on pure gold.<br />
[55] A. Pan<strong>in</strong>, A. Shugurov, J. Schreiber, Surf. Sci. 524, 191 (2003), Fractal analysis<br />
of electromigration-<strong>in</strong>duced changes of surface topography <strong>in</strong> Au conductor l<strong>in</strong>es.