ESD Ankündigung 2013

ESD FORUM e.V.
Subject of the conference are electrostatic effects on solid state
electronics. The intention is to support the discussion between the
scientific and industrial communities within Europe in order to
improve possible solutions for ESD related problems for any
application of electronic components. The ESD Forum will also
present current available information.
Submitted papers should cover the following fields:
ESD and EOS on Device Level
• ESD- and Latch-up requirements for devices
• Static and transient latch-up
• Test methodology, stress models and standardization
(ESD, EOS, Latch-up)
• Characterization methods on device and wafer level
(TLP, failure analysis procedures, …)
• Problem of today’s test methods: correlation of different
test procedures, artefacts, high pin-count testing, …
• On-chip ESD protection concepts and protection structures
• Challenges caused by high voltage, RF, LEDs, MEMs,
package and system integration, …
• Physical modelling of discharge and protection concepts,
use of software to avoid design weaknesses
• Influence of ESD and EOS on yield and reliability
ESD Precaution in the Production
• ESD und EOS problems in production area
• Packing, handling and transport of ESD sensitive devices
• Analysis and consequences of occurred problems
(case studies)
• Test and analysis methods, correlation of test methods
• New materials
• Problems when applying standards
• Standards/Guidelines for fully automated production lines
• ESD precaution programs, cost benefit analysis,
application in OEM production line
• ESD precaution in automated process and test procedures
• Training of qualified ESD personnel
ESD and EOS on System Level
• Field problems, ESD stress in the field
• ESD and EOS requirements in systems of different
applications (automotive, health care, communication, …)
• Voltages and currents, electrical and magnetic fields at
ESD and EOS events in the system and during simulation
• Test methods of ESD and EOS events in systems,
IEC 61000-4-2, ISO 10605, correlation to field failures
• Propagation of ESD and EOS pulses within a system
• Protection methods on system level; numeric simulation
• Correlation of ESD/EOS robustness of devices and
systems; classification/differentiation ESD/EOS
13 th ESD-FORUM
November 19 th – 20 th , 2013
Holiday Inn Berlin – City West
*** ANNOUNCEMENT and CALL FOR PAPERS ***
www.esdforum.de
Conference Language
German or English language may be used for printed materials,
presentation and discussion.
All accepted papers will be published in the “ESD Forum”
conference proceedings.
Submission Guidelines
Extended abstracts of 500 words should be
sent by e-mail to:
Tilo Brodbeck
e-mail tilo.brodbeck@esdforum.de
Phone +49 (0) 89 / 54779512
Dead Lines
June 29 th , 2013 Submission of extended abstracts
August 16 th , 2013 Notification of accepted papers
September 30 th , 2013 Submission of full papers
Award
The best paper will be awarded by the Technical Program
Committee.
Chairman
Armin Gottschalk
Chairman Technical Program Committee
Tilo Brodbeck
Technical Program Committee
Members of the ESD FORUM e.V.
Organisation
Companies interested in presenting literature are requested
to contact:
Armin Gottschalk
e-mail armin.gottschalk@esdforum.de
Cell +49 (0) 178/7859327
Fax +49 (0) 9081/86461
ESD Forum e.V.
Eichendorffstr. 1
D-86720 Nördlingen